Oak-Mitsui

Mitsui Kinzoku Corporate Group
A division of Mitsui Kinzoku
www.oakmitsui.com

Copper Foil

OAK-MITSUI
Copper Foil
www.oakmitsui.com

PLSP

The PLSP product meets IPC grade 1 requirements for electrodeposited copper foil. PLSP is commonly used in industrial applications such as EMI/RFI shielding applications where traditional bonding treatments are not necessary. Performance benefits include:

•Cost effective replacement for RA foils.
•Passivation coating resists oxidation.
•Has both a shiny side and a matte side finish.
•No oil or organic coatings.
•Available in widths up to 53 inches.

PLSP Product Data Sheet (Std) (pdf) Opens in new window


Typical Matte and Drum Side Images:

0

Shiny (Drum) Side 3oz PLSP

Matte Side 3oz PLSP

0

Shiny (Drum) Side 3oz PLSP (1000x)

Matte Side 3oz PLSP (1000x)

Typical Foil Properties:

Product Designation

oz/ft2

1/2oz

1oz

2oz

3oz

4oz

5oz

6oz

Calculated Thickness*

Inches

0.0006

0.0012

0.0025

0.004

0.0052

0.0064

0.0078

Ambient Tensile

Kpsi
kg/mm2

60
42.2

55
38.7

52.5
36.9

50.0
35.2

47.5
33.4

45.0
31.6

45.0
31.6

Ambient Elongation

%E

8

15

20

25

27.5

30

30

Roughness -Ra
Untreated (Drum) Side

µinch
µm

10
.25

10
.25

10
.25

10
.25

10
.25

10
.25

10
.25

Roughness -Ra
Treated (Matte) Side

µinch
µm

20
0.51

30
0.76

55
1.40

90
2.29

105
2.67

130
3.30

150
3.81

*Note: Calculated thickness is determined by area weight. Actual measured thickness may be slightly higher due to matte side topography.

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IPC

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