Oak-Mitsui

Mitsui Kinzoku Corporate Group
A division of Mitsui Kinzoku
www.oakmitsui.com

Copper Foil

OAK-MITSUI
Copper Foil
www.oakmitsui.com

MHT-DT

MHT-DT is a grade 3 (HTE) copper foil designed for inner layer applications with treatment applied to both the matte and drum side. This product has high temperature, heat resistant treatment designed to provide high bonds strength on a wide range of high Tg substrates and low loss resins. Typical substrates include polyimide, BT, CE, and hydrocarbon ceramics. Performance benefits include:

•Effectively eliminates “pink ring".
•Reduced cost with the elimination of oxide process.
•HTE characteristics eliminates inner layer foil cracking..

MHT-DT Product Data Sheet (pdf) Opens in new window


Typical Matte and Drum Side Images:

0

Treated (Matte) Side MHT-DT (1/2 oz)

Treated (Drum) Side MHT-DT (1/2 oz)

Typical Foil Properties:

Nominal Thickness*

microns

18

35

70

Area Weight

oz/ft2

1/2

1

2

Ambient Tensile

Kpsi
kg/mm2

60
42.2

55
38.7

52.5
36.9

High Temp Tensile @180ºC

Kpsi
kg/mm2

30
21.1

30
21.1

30
21.1

Ambient Elongation

%E

8

15

20

High Temp Elongation @180ºC

%E

8

8

8

Roughness -Rz
Treated (Drum) Side

µinch
µm

160
4.1

160
4.1

160
4.1

Roughness -Rz
Treated (Matte) Side

µinch
µm

200
5.1

250
6.3

400
10.2

B Condition Peel
Polyimide
Treated (Matte) Side

lbs/in
kg/cm

5.5
0.98

6.5
1.16

7.0
1.25

B Condition Peel
Polyimide
Treated (Drum) Side

lbs/in
kg/cm

5.5
0.98

6.5
1.16

7.0
1.25

*Note: Nominal thickness is determined by area weight. Actual measured thickness may be slightly higher due to matte side topography.

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