Oak-Mitsui

Mitsui Kinzoku Corporate Group
A division of Mitsui Kinzoku
www.oakmitsui.com

Copper Foil

OAK-MITSUI
Copper Foil
www.oakmitsui.com

TOC500

TOC500 is a zinc-free copper foil designed for applications on PTFE (TeflonTM) and other fluorocarbon resin-based, high frequency laminates. Performance benefits include:

•Excellent adhesion to PTFE.
•Stabilized shiny-side reduces oxidation for ease of processing.
•Uniform surface area minimizes signal loss..

TOC500 Product Data Sheet (pdf) Opens in new window


Typical Matte and Drum Side Images:

0

Treated (Matte) Side TOC500 (1/2 oz)

Untreated (Drum) Side TOC500 (1/2 oz)

Typical Foil Properties:

Nominal Thickness*

microns

18

35

70

Area Weight

oz/ft2

1/2

1

2

Ambient Tensile

Kpsi
kg/mm2

60
42.2

55
38.7

52.5
36.9

High Temp Tensile @180ºC

Kpsi
kg/mm2

30
21.1

30
21.1

30
21.1

Ambient Elongation

%E

8

15

20

High Temp Elongation @180ºC

%E

8

8

8

Roughness -Ra
Untreated (Drum) Side

µinch
µm

10
.25

10
.25

10
.25

Roughness -Rz
Treated (Matte) Side

µinch
µm

200
5.1

250
6.3

400
10.2

Peel Strength
PTFE
Treated (Matte) Side

lbs/in
kg/cm

7.5
1.34

10.5
1.87

15.0
2.68

*Note: Nominal thickness is determined by area weight. Actual measured thickness may be slightly higher due to matte side topography.

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