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MLS TOC500 is a reverse treated, zinc free copper foil designed
for applications on PTFE (TeflonTM) and other fluorocarbon resin-based, high frequency laminates.
Performance benefits include:
- •VLP bonding surface, minimal foil treatment residue after etching.
- •Superior etch factor for fine lines.
- •Reduced costs through process step elimination during PCB fabrication.
- •HTE characteristics eliminate inner layer foil cracking.
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MLS-TOC500 Product Data Sheet (Std)
(pdf) 
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Typical Matte and Drum Side Images:
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Treated (Drum) Side MLS-TOC500 (1/2 oz)
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Untreated (Matte) Side MLS-TOC500 (1/2 oz)
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High Temp Elongation @180ºC |
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Roughness -Rz
Treated (Drum) Side |
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Roughness -Rz
Untreated (Matte) Side |
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Peel Strength
PTFE
Treated (Drum) Side |
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*Note: Nominal thickness is determined by area weight. Actual measured thickness may be slightly higher due to matte side topography.
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