Oak-Mitsui

Mitsui Kinzoku Corporate Group
A division of Mitsui Kinzoku
www.oakmitsui.com

Copper Foil

OAK-MITSUI
Copper Foil
www.oakmitsui.com

MLS-MHT

MLS-MHT is a reverse treated foil designed for high Tg resin systems such as Polyimide, BT, CE, Hydrocarbon-ceramic and Fluorocarbon substrates. This product is typically used for inner layer applications where controlled impedance and high density fine lines are required. Performance benefits include:

•Very Low Profile Bonding Surface.
•Excellent Etch Factor for fine lines.
•HTE characteristics eliminate inner layer foil cracking.
•Increased treatment surface area for improved / enhanced peels on Polyimide and other high Tg substrates.
•Untreated (matte) side passivation has excellent anti tarnish resistance at higher processing temperatures.

MLS-MHT Product Data Sheet (Std) (pdf) Opens in new window


Typical Matte and Drum Side Images:

0

Treated (Drum) Side MLS-MHT (1/2 oz)

Untreated (Matte) Side MLS-MHT (1/2 oz)

Typical Foil Properties:

Nominal Thickness*

microns

18

35

70

Area Weight

oz/ft2

1/2

1

2

Ambient Tensile

Kpsi
kg/mm2

60
42.2

55
38.7

52.5
36.9

High Temp Tensile @180ºC

Kpsi
kg/mm2

30
21.1

30
21.1

30
21.1

Ambient Elongation

%E

8

15

20

High Temp Elongation @180ºC

%E

8

8

8

Roughness -Rz
Treated (Drum) Side

µinch
µm

160
4.1

160
4.1

160
4.1

Roughness -Rz
Untreated (Matte) Side

µinch
µm

175
4.4

225
5.7

350
8.9

B Condition Peel
Polyimide
Treated (Drum) Side

lbs/in
kg/cm

5.5
0.98

6.5
1.16

7.0
1.25

*Note: Nominal thickness is determined by area weight. Actual measured thickness may be slightly higher due to matte side topography.

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