Oak-Mitsui

Mitsui Kinzoku Corporate Group
A division of Mitsui Kinzoku
www.oakmitsui.com

Copper Foil

OAK-MITSUI
Copper Foil
www.oakmitsui.com

MLS

MLS is a reverse-treated, Grade 3, controlled elongation foil. This product is designed for inner layer applications where controlled impedance and high density, fine lines are required. MLS is fully compatible with all epoxy resin systems. Performance benefits include:

•VLP bonding surface, minimal foil treatment residues after etching.
•Superior etch factor for fine lines.
•Reduced costs through process step elimination during PCB fabrication.
•HTE characteristics eliminate inner layer foil cracking.

MLS Product Data Sheet (Std) (pdf) Opens in new window


Typical Matte and Drum Side Images:

0

Treated (Drum) Side MLS (1/2 oz)

Untreated (Matte) Side MLS (1/2 oz)

Typical Foil Properties:

Nominal Thickness*

microns

9

12

18

35

70

Area Weight

oz/ft2

1/4

3/8

1/2

1

2

Ambient Tensile

Kpsi
kg/mm2

60
42.2

60
42.2

60
42.2

55
38.7

52.5
36.9

High Temp Tensile @180ºC

Kpsi
kg/mm2

30
21.1

30
21.1

30
21.1

30
21.1

30
21.1

Ambient Elongation

%E

>3

6

8

15

20

High Temp Elongation @180ºC

%E

8

8

8

8

8

Roughness -Rz
Treated (Drum) Side

µinch
µm

120
3.0

120
3.0

120
3.0

120
3.0

120
3.0

Roughness -Rz
Untreated (Matte) Side

µinch
µm

100
2.5

125
3.2

175
4.4

225
5.7

350
8.9

B Condition Peel
Epoxy Tg 170ºC
Treated (Drum) Side

lbs/in
kg/cm

>5
>0.9

6.0
1.07

6.0
1.07

8.0
1.43

11.0
1.96

*Note: Nominal thickness is determined by area weight. Actual measured thickness may be slightly higher due to matte side topography.

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