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ML is an IPC Grade 3, low profile, controlled elongation copper foil designed specifically for multilayer applications.
ML foil is supplied with a TOB treatment (Treatment of Brass), which is fully compatible with all epoxy resin systems.
Performance benefits include:
- •Low profile for finer lines and consistent etching.
- •Decreased foil treatment residues after etching.
- •Controlled %E @180º for consistent drilling.
- •HTE characteristics eliminate inner layer foil cracking.
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ML Product Data Sheet (Std)
(pdf) 
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Typical Matte and Drum Side Images:
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Treated (Matte) Side ML (1/2 oz)
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Untreated (Drum) Side ML (1/2 oz)
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High Temp Elongation @180ºC |
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Roughness -Ra
Untreated (Drum) Side |
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Roughness -Rz
Treated (Matte) Side |
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B Condition Peel
Epoxy Tg 170ºC
Treated (Matte) Side |
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*Note: Nominal thickness is determined by area weight. Actual measured thickness may be slightly higher due to matte side topography.
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