Oak-Mitsui

Mitsui Kinzoku Corporate Group
A division of Mitsui Kinzoku
www.oakmitsui.com

Copper Foil

OAK-MITSUI
Copper Foil
www.oakmitsui.com

MHT

MHT is an advanced Grade 3 (HTE) copper foil with a high temperature, heat resistant treatment designed to provide high bond strength on a wide range of high Tg substrates and low loss resins. Typical substrates include polyimide, BT, CE, and hydrocarbon-ceramics. Performance benefits include:

•Excellent thermal stability for improved PWB performance.
•Enhanced bonding treatment for Polyimide and other high Tg resins results in improved adhesion.
•Low profile for foil thicknesses less than 70 microns for finer lines and consistent etching.

MHT Product Data Sheet (pdf) Opens in new window


Typical Matte and Drum Side Images:

0

Treated (Matte) Side MHT (1/2 oz)

Untreated (Drum) Side MHT (1/2 oz)

Typical Foil Properties:

Nominal Thickness*

microns

12

18

35

70

Area Weight

oz/ft2

3/8

1/2

1

2

Ambient Tensile

Kpsi
kg/mm2

60
42.2

60
42.2

55
38.7

52.5
36.9

High Temp Tensile @180ºC

Kpsi
kg/mm2

30
21.1

30
21.1

30
21.1

30
21.1

Ambient Elongation

%E

6

8

15

20

High Temp Elongation @180ºC

%E

8

8

8

8

Roughness -Ra
Untreated (Drum) Side

µinch
µm

10
.25

10
.25

10
.25

10
.25

Roughness -Rz
Treated (Matte) Side

µinch
µm

200
5.1

200
5.1

250
6.3

400
10.2

B Condition Peel
Polyimide
Treated (Matte) Side

lbs/in
kg/cm

5.0
0.9

5.5
0.98

6.5
1.16

7.0
1.25

*Note: Nominal thickness is determined by area weight. Actual measured thickness may be slightly higher due to matte side topography.

TOP TOP






FaradFlex

IPC

PO Box 501, Hoosick Falls, New York 12090 • Phone (518) 686-8060 • [email protected]
Copyright © 2005 Oak-Mitsui