|
3EC-HTE is an IPC4562 grade 11 electrodeposited low temperature annealable copper foil.
This product is used in flexible printed circuit board applications.
This superflex product has excellent flex performance that is comparable to RA copper foil.
Performance benefits include:
- •Cost effective replacement for RA foils.
- •Flex performance comparable to RA copper foil after annealing.
- •Copper bonding treatment on matte side of foil provides excellent adhesion to a wide variety of substrates.
- •Zinc chromate passivation resists oxidation through a wide range of processing conditions.
- •No oil or organic coatings.
- •Available in widths up to 53 inches (1346 mm).
|
3EC-HTE Product Data Sheet (Std)
(pdf) 
|
|
Typical Matte and Drum Side Images:
|
|
|
|
Drum Side
1/2oz 3EC-HTE (1500x)
|
|
Matte Side (Treated)
1/2oz 3EC-HTE (1500x)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Ambient Tensile
after 1hr @180ºC |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Ambient Elongation
after 1hr @180ºC |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
*Note: Nominal thickness is determined by area weight. Actual measured thickness may be slightly higher due to matte side topography.
|
| 
