Designers and fabricators are always looking for ways to reduce track width and increase circuit reliability. MicroThin^® is an effective solution.

MicroThin^® is typically used in high-density circuit applications. It is very low profile copper foil (3µm or 5µm) bonded to an 18µm or 35µm disposable copper foil carrier which is peeled-off after lamination and recycled.

The benefits of MicroThin^® include:

• Easy to release carrier after high temperature lamination

• Uniform thickness of ultra thin foil

• Ease in handling super thin copper foil

• Protection from defects during shipping and lamination

• Very fine circuit pattern production

• Sufficient peel strength

MicroThin^® Website