Oak-Mitsui is pleased to announce the March 29, 2005 opening of a new copper foil research and development facility in the U.S.  Originally made public in October of last year and under construction since that time, the facility utilizes a portion of the company’s Hoosick Falls, N.Y. copper foil manufacturing plant that has been idle since 2001, when it was shut down due to the downturn in the electronics industry. The activities of the center will be managed by Oak-Mitsui Technologies (organized in 2003 to investigate and develop new products for the electronics industry) and will coordinate efforts with the R&D being conducted at parent company Mitsui Kinzoku’s Central Laboratory in Ageo, Japan.

Mr. Muneo Saida, Global Director of Copper Foil for Mitsui Kinzoku, and Mr. Yasuo Yokoo, Chief Technology Officer traveled from Japan to attend the opening ceremony.

“We are very excited to see additional new life for our Hoosick Falls facility,” states Jeffrey Gray, President of Oak-Mitsui, Inc.   “The technology we develop here will serve as a platform for new copper foil products in markets across the globe.”

Oak-Mitsui specializes in the production and distribution of world-class performance copper foils, Aluminum-Bonded-Copper (ABC^TM), and advanced materials for electronic interconnect applications. These advanced materials include MultiFoil^TM resin coated foil, MicroThin^TM ultra-thin copper foils (3 and 5 micron) on a releasable copper carrier and the FaradFlex^® line of ZBC^TM Licensed Buried Capacitor material.

Headquartered in Hoosick Falls, New York, with locations in Camden, SC, and Riverside, CA, Oak-Mitsui is a wholly owned subsidiary of Mitsui Kinzoku Corporate Group. 

For additional information concerning Oak-Mitsui products, see our website at www.oakmitsui.com or contact John Blaber, Vice President of Sales and Marketing, Oak Mitsui Inc. at mailto:OM.Sales@oakmitsui.com.