OAK-MITSUI TECHNOLOGIES AND OHMEGA TECHNOLOGIES PRESENT ON COMBINED RESISTOR-CAPACITOR MATERIAL

Ohmega-Ply^® /FaradFlex^® Embedded Resistor-Capacitor Layer

Santa Clara, CA (February 7, 2006) and Anaheim, CA (February 9,2006)—At this years DesignCon in Santa Clara and IPC Expo 2006 Oak-Mitsui Technologies and Ohmega Technologies, Inc. presented on a new embedded passive product  that combines their two industry-leading embedded passives products:  Ohmega-Ply^® thin-film embedded resistor material and FaradFlex^® distributed capacitive material.

The combination of these two embedded passive materials creates a new patent pending resistor/capacitor core offering the printed circuit design engineer the ability to incorporate both embedded resistors and a distributed capacitive plane onto one core within a multilayer printed circuit board. 

The new product is an Ohmega-Ply^®/FaradFlex^® laminate consisting of Ohmega-Ply RCM^® laminated to FaradFlex^® BC24M dielectric available in sheet resistances of 10 ohm, 25 ohm, 50 ohm, 100 ohm or 250 ohm per square. Further dielectric offerings are planned for future release.

Each material alone provides excellent embedded passive capability, but it was discovered that the combined product enhances the performance of each component.  The reasons for using embedded passives, the processing of the material along with its properties and some possible applications was explained by John Andresakis, VP of Strategic Technologies for Oak-Mitsui Technologies. The combined Ohmega-Ply^®/FaradFlex^® product allows for fewer circuit layers and greater densities.

For more information on Ohmega-Ply^®/FaradFlex^® please contact:

Ohmega Technologies, Inc.                                               Oak-Mitsui Technologies, LLC

4031 Elenda St.                                                                     80 1^st Street

Culver City, CA 90232                                                         Hoosick Falls, NY 12090

Attn: Bruce Mahler                                                              Attn: John Andresakis

Phone: 310-559-4400                                                            Phone: 518-686-8088

e-mail: bmahler@ohmega.com                                           e-mail: John.Andresakis@oakmitsui.com

About Ohmega Technologies, Inc.

Ohmega Technologies, Inc. is the industry leading producer of embedded resistor materials with its Ohmega-Ply^® family of innovative thin-film resistive materials.  Ohmega-Ply^® has been in production and use for over three decades with unsurpassed reliability in a wide variety of electronic applications. For more information on Ohmega Technologies’ products, please visit www.ohmega.com

About Oak-Mitsui Technologies, LLC

Oak-Mitsui Technologies is a subsidiary of copper foil producer Oak-Mitsui.  Oak-Mitsui specializes in the development and production of world-class performance copper foils and advanced materials for electronic interconnect applications.  Oak-Mitsui is a subsidiary of Mitsui Kinzoku Corporate Group, the world’s largest manufacturer of copper foils for electronics and is a licensee of Sanmina-SCI Buried Capacitance Technology. For additional information concerning Oak-Mitsui products, please visit www.oakmitsui.com