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Oak-Mitsui to Exhibit at IPC APEX/EXPO 2013
See us at Booth 1700 to discover the latest in Copper Foil Technology, Lamination Products and FaradFlex Embedded Capacitor Material
Oak-Mitsui to Exhibit at IPC APEX/EXPO 2012
See us at Booth 2200 to discover the latest in Copper Foil Technology, Lamination Products and FaradFlex Embedded Capacitor Material
Oak-Mitsui to Exhibit at IPC APEX/EXPO 2011
See us at Booth 1125 to discover the latest in Copper Foil Technology, Lamination Products and FaradFlex Embedded Capacitor Material
Oak-Mitsui to Exhibit at IPC APEX/EXPO 2010
See us at Booth 924 to discover the latest in Copper Foil Technology, Lamination Products and FaradFlex Embedded Capacitor Marterial
Attend: Materials for HDI and Advanced PCBs - Professional Development Course at IPC APEX-EXPO 2009
John Andresakis, VP of Strategic Technology, will present the material options available for HDI and Advanced PCBs including Embedded Passives. Session is PD-45 on Monday March 30th.
Oak-Mitsui Technologies to Exhibit at DesignCon 2009
See us at Booth 813 to discuss the latest in Embedded Capacitor Technology and Materials for HDI
Interviews at IPC APEX/EXPO 2008
Open file below to get links to Interviews with Bob Carter on Embedded ESD Protection and John Andresakis on Printed Electronics
Visitors to Oak-Mitsui at IPC EXPO/APEX in Las Vegas
We wish to thank all who visited us at this years successful event
Oak-Mitsui Technologies and Shocking Technologies sign Letter of Intent
Plan to Commercialize X static(tm) material for Embedded ESD Protection
Harris Corp to Present on Embedded Passives at IPC EXPO/APEX on 4/2
Paper in Session S22 describes benefits of Embedded Passives including FaradFlex
Oak-Mitsui Technologies achieves ISO 9000 Registration
NQA USA, has approved FaradFlex Production Facility for ISO 9000 Registration. Copy of Certificate available for download.
Mitsui Mining and Smelting Launches New English Version Web Site
Oak-Mitsui´s parent company, MMS, has just launced a new website. Click on the Mitsui logo to the far right to visit.
Oak-Mitsui Technologies @ PCB Design-West
We would like to thank those that visited TechDream and our booth at the show. Please visit http://www.pcb007.com/galleries/PCBDesignWest07/oak_dm.htm to view Interview with Bob Carter of OMT.
Designing and Building a Board with Embedded Passive Components: An Interactive Workshop Hosted by NSWC - CRANE
Oak-Mitsui to Participate in Training on June19th and 20th
Oak-Mitsui Interviewed at IPC EXPO/APEX 2007
Visit www.realtimewith.com to view interview with John Andresakis of Oak-Mitsui and Bruce Mahler of Ohmega Technologies. Interview is in Technology Section.
Oak-Mitsui Presentation from DesignCon 2007
We would like to thank those that came by our booth and expressed interest in our FaradFlex products. Presentation is available as PDF for downloading by clicking on the read more link..
Combined Ohmega-FaradFlex Material Granted US Patent
A US Patent was granted on Combined Material for Embedded Resistors and Buried Capacitance to Ohmega Technologies and Oak-Mitsui. Audio Interview available on PCB007.com
IPC Announces 3rd International Conference on Embedded Passives
Oak-Mitsui Technologies to present two papers. View pdf for more information.
Motorola and Mitsui Mining and Smelting announce Agreement
Commercialization of Gen 3 Embedded Capacitor Technology
Oak-Mitsui Technologies and Ohmega Technologies
Present at DesignCon 2006 and IPC EXPO 2006
Oak-Mitsui Technologies Presents at IPCWorks 2005
Presentation on Embedded Capacitance available for downolad
OMT issues RoHS Compliance Letter for FaradFlex Products
Letter Available for Download Below
The Next Generation of Ultra-Thin Copper Foils for Ultra Fine Line Formation
Oak Mitsui Opens New Research and Development Facility