Oak-Mitsui

Mitsui Kinzoku Corporate Group
A division of Mitsui Kinzoku
www.oakmitsui.com

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OAK-MITSUI
Copper Foil
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Here you can find various news items. You can filter by category with the dropdown menu. If you do not see what you’re looking for, please contact us.

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5/19/2016
Oak-Mitsui and Insulectro
Oak-Mitsui ABC products are now available through Insulectro. Please contact your Insulectro representative for more details.

3/28/2008
Oak-Mitsui Technologies and Shocking Technologies sign Letter of Intent
Plan to Commercialize X static(tm) material for Embedded ESD Protection

3/18/2008
Harris Corp to Present on Embedded Passives at IPC EXPO/APEX on 4/2
Paper in Session S22 describes benefits of Embedded Passives including FaradFlex

12/20/2007
Oak-Mitsui Technologies achieves ISO 9000 Registration
NQA USA, has approved FaradFlex Production Facility for ISO 9000 Registration. Copy of Certificate available for download.

7/12/2007
Mitsui Mining and Smelting Launches New English Version Web Site
Oak-Mitsui´s parent company, MMS, has just launced a new website. Click on the Mitsui logo to the far right to visit.

3/13/2007
Designing and Building a Board with Embedded Passive Components: An Interactive Workshop Hosted by NSWC - CRANE
Oak-Mitsui to Participate in Training on June19th and 20th

3/8/2007
Oak-Mitsui Interviewed at IPC EXPO/APEX 2007
Visit www.realtimewith.com to view interview with John Andresakis of Oak-Mitsui and Bruce Mahler of Ohmega Technologies. Interview is in Technology Section.

1/11/2007
Combined Ohmega-FaradFlex Material Granted US Patent
A US Patent was granted on Combined Material for Embedded Resistors and Buried Capacitance to Ohmega Technologies and Oak-Mitsui. Audio Interview available on PCB007.com

4/7/2006
Motorola and Mitsui Mining and Smelting announce Agreement
Commercialization of Gen 3 Embedded Capacitor Technology

11/2/2005
Oak-Mitsui Technologies Presents at IPCWorks 2005
Presentation on Embedded Capacitance available for download

8/11/2005
OMT issues RoHS Compliance Letter for FaradFlex Products
Letter Available for Download Below

8/2/2005
MicroThin-Ex™
The Next Generation of Ultra-Thin Copper Foils for Ultra Fine Line Formation

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