Designers and fabricators are always arguing about how to reduce track width and increase reliability of the circuitry. One effective solution is MicroThin®.

MicroThin® is a very low profile copper 3µm or 5µm copper foil with an 18µm or 35µm peelable copper carrier for high-density circuit applications. The releasing layer can be peeled-off after lamination and recycled.

The Benefits of MicroThin® include:

• Easy to release carrier after high temperature lamination
• Uniform thickness of ultra thin foil
• Ease in handling super thin copper foil
• Protection from defects during shipping and lamination
• Very fine circuit pattern production
• Sufficient peel strength