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FaradFlex®Oak-Mitsui has developed a novel thin substrate, FaradFlex®, which is the next generation of Buried Capacitance material.
Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the power distribution system as well as free up surface real estate and improve system reliability by eliminating some discrete capacitors.
The FaradFlex® Line of Capacitor Material includes unfilled, filled, and partially filled Materials.
 OM Faradflex Brochure 07 (1.12mb pdf)  MSDS FaradFlex BC (36kb pdf) MSDS FaradFlex BCxxT (36kb pdf) Oak-Mitsui FaradFlex Data Table 07 (36kb pdf) FaradFlex processing guideline (483kb pdf)
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