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 Oak-Mitsui™ (OM) specializes in the development and production of world class performance copper foils, Aluminum Bonded Copper (ABC), and Advanced Interconnect Materials (AIM) for electronic interconnect (printed circuit board) applications. Headquartered in Camden, SC, with locations in Hoosick Falls, New York and Riverside, CA, Oak-Mitsui is a subsidiary of Mitsui Kinzoku Corporate Group, the world's largest manufacturer of copper foils for electronics. |
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Oak-Mitsui to Exhibit at IPC APEX/EXPO 2009
See us at Booth 816 to discover the latest in Copper Foil Technology, Lamination Products and FaradFlex Embedded Capacitor Marterial
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Attend: Materials for HDI and Advanced PCBs - Professional Development Course at IPC APEX-EXPO 2009
John Andresakis, VP of Strategic Technology, will present the material options available for HDI and Advanced PCBs including Embedded Passives. Session is PD-45 on Monday March 30th.
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Oak-Mitsui Technologies to Exhibit at DesignCon 2009
See us at Booth 813 to discuss the latest in Embedded Capacitor Technology and Materials for HDI
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